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Typical Application Semiconductor Wafer Photoresist Coating Ultrasonic Nozzles 30Khz Scattering

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Typical Application Semiconductor Wafer Photoresist Coating Ultrasonic Nozzles 30Khz Scattering

Brand Name : FUNSONIC

Model Number : FSW-3002-L

Certification : CE

Place of Origin : CHINA

MOQ : 1 UNIT

Price : Negotation

Payment Terms : T/T, Western Union

Supply Ability : 1000 unit per month

Packaging Details : Packed by carton

Production Name : 30Khz Scattering Ultrasonic Nozzle Atomization

Frequency : 30Khz

Max Power : 1-15w

Automized Particle Size Range : 15-40μm

Spray flow : 0.5-20ml

Liquid viscosity : <30cps

Particle size : <12μm

Application : Suitable for full surface spraying of flux

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Typical Application Semiconductor Wafer Photoresist Coating Ultrasonic Nozzles 30Khz Scattering

Description:

The scattering type ultrasonic nozzle is an ultrasonic atomizing nozzle with a cyclone cone spray. It uses the ultrasonic atomization nozzle technology, and through the special vortex flow channel design, the carrier gas is converted into a uniform rotating airflow, so that the ultrasonic atomization of the liquid mist is dispersed in the form of a cyclone spray, expanding the spray area of the atomizer. Ultrasonic nozzles can also be sprayed on vertical or curved surfaces and other substrates with sharp edges.

Parameters:

Model FSW-3002-L
Name 30Khz Scattering Ultrasonic Nozzle Atomization
Frequency 30Khz
Atomized particle size range(μm) 15-40
Spray width(mm) 40-80
Spray flow(ml/min) 0.5-20
Spray height(mm) 30-80
Liquid viscosity (cps) <30
Particle size (μm) <15
Diversion pressure (Mpa) <0.05
Application Suitable for Photoresist coatings on semiconductor chips

Typical Application Semiconductor Wafer Photoresist Coating Ultrasonic Nozzles 30Khz Scattering

Compared to traditional spraying techniques, ultrasonic spraying has the following advantages:

1. Spray uniformity: ultrasonic spraying can achieve more uniform coating coverage by generating tiny spray particles. This uniformity can reduce the thickness difference of the coating, improve the quality and appearance of the coating.

2. High efficiency and energy saving: ultrasonic spraying can effectively transform liquid into tiny spray particles, so as to achieve higher spraying efficiency. Compared to traditional spraying techniques, it can save the use of coatings and solvents, and reduce energy consumption during the spraying process.

3. Fine control: Ultrasonic spraying technology can achieve fine control of the spraying process. By adjusting the frequency, amplitude and spraying parameters of ultrasonic vibration, the particle size, distribution and spraying speed of spray can be accurately controlled to meet different application requirements.

4. Reduce aerosol dispersion: The spray particles produced by ultrasonic spraying are smaller, which can reduce aerosol dispersion compared with traditional spraying technology. This is beneficial for the environment and the health and safety of operators.

5. Suitable for special materials: Ultrasonic spraying technology is suitable for various types of liquid materials, including high viscosity liquids, high solid content liquids, nanoparticle suspensions, etc. In contrast, traditional spraying techniques may not be able to effectively spray these special materials.

It should be noted that ultrasonic spraying technology also has some limitations and applicable conditions, such as relatively high equipment costs and certain requirements for the physical and chemical properties of liquids. When choosing spraying technology, it is necessary to comprehensively consider specific application requirements and technical characteristics.

Typical Application Semiconductor Wafer Photoresist Coating Ultrasonic Nozzles 30Khz Scattering

Typical Application Semiconductor Wafer Photoresist Coating Ultrasonic Nozzles 30Khz ScatteringTypical Application Semiconductor Wafer Photoresist Coating Ultrasonic Nozzles 30Khz Scattering


Product Tags:

Photoresist Coating Ultrasonic Nozzles

      

30Khz Scattering Ultrasonic Nozzles

      

Semiconductor Wafer Ultrasonic Nozzles

      
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